XC4VLX15-11FFG668C
vs
XC4VLX15-11SF363IS2
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
| Package Description |
LEAD FREE, FBGA-668
|
FBGA, BGA363,20X20,32
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| Factory Lead Time |
12 Weeks
|
|
| Clock Frequency-Max |
1205 MHz
|
1205 MHz
|
| Combinatorial Delay of a CLB-Max |
0.17 ns
|
0.17 ns
|
| JESD-30 Code |
S-PBGA-B668
|
S-PBGA-B363
|
| JESD-609 Code |
e1
|
e0
|
| Length |
27 mm
|
17 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
1536
|
1536
|
| Number of Inputs |
320
|
240
|
| Number of Logic Cells |
13824
|
13824
|
| Number of Outputs |
320
|
240
|
| Number of Terminals |
668
|
363
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
1536 CLBS
|
1536 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
FBGA
|
| Package Equivalence Code |
BGA668,26X26,40
|
BGA363,20X20,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
250
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.85 mm
|
1.99 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
27 mm
|
17 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
363
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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