XC4VLX15-11FFG676I vs XC4VLX15-11FFG676IS2 feature comparison

XC4VLX15-11FFG676I AMD Xilinx

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XC4VLX15-11FFG676IS2 AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description BGA, BGA676,26X26,40
Pin Count 676
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1205 MHz
Combinatorial Delay of a CLB-Max 0.17 ns
JESD-30 Code S-PBGA-B676
JESD-609 Code e1
Length 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1536
Number of Inputs 320
Number of Logic Cells 13824
Number of Outputs 320
Number of Terminals 676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Terminal Finish Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 27 mm
Base Number Matches 1 1

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