XC4VLX25-10SF363C vs XC4VLX25-10SF363IS2 feature comparison

XC4VLX25-10SF363C AMD Xilinx

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XC4VLX25-10SF363IS2 AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description FBGA-363 FBGA, BGA363,20X20,32
Pin Count 363
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Clock Frequency-Max 1028 MHz 1028 MHz
JESD-30 Code S-PBGA-B363 S-PBGA-B363
JESD-609 Code e0 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 4 4
Number of CLBs 2688 2688
Number of Inputs 240 240
Number of Logic Cells 24192 24192
Number of Outputs 240 240
Number of Terminals 363 363
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 2688 CLBS 2688 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA363,20X20,32 BGA363,20X20,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.99 mm 1.99 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 2 1
Combinatorial Delay of a CLB-Max 0.2 ns

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Compare XC4VLX25-10SF363IS2 with alternatives