XC5215-5BG352C vs XC5215-4BG352C feature comparison

XC5215-5BG352C AMD Xilinx

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XC5215-4BG352C AMD Xilinx

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description PLASTIC, BGA-352 PLASTIC, BGA-352
Pin Count 352 352
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAX AVAILABLE 23000 LOGIC GATES MAX AVAILABLE 23000 LOGIC GATES
Clock Frequency-Max 83 MHz 83 MHz
Combinatorial Delay of a CLB-Max 4.6 ns 3.8 ns
JESD-30 Code S-PBGA-B352 S-PBGA-B352
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 3 3
Number of CLBs 484 484
Number of Equivalent Gates 15000 15000
Number of Inputs 244 244
Number of Logic Cells 484 484
Number of Outputs 244 244
Number of Terminals 352 352
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 484 CLBS, 15000 GATES 484 CLBS, 15000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA352,26X26,50 BGA352,26X26,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

Compare XC5215-5BG352C with alternatives

Compare XC5215-4BG352C with alternatives