XC5215-5HQ304C
vs
XC5215-6HQ304I
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
HEAT SINK, PLASTIC, QFP-304
|
HEAT SINK, PLASTIC, QFP-304
|
Pin Count |
304
|
304
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
TYP. GATES = 15000-23000
|
TYP. GATES = 15000-23000
|
Clock Frequency-Max |
83 MHz
|
83 MHz
|
Combinatorial Delay of a CLB-Max |
4.6 ns
|
5.6 ns
|
JESD-30 Code |
S-PQFP-G304
|
S-PQFP-G304
|
JESD-609 Code |
e0
|
e0
|
Length |
40 mm
|
40 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
484
|
484
|
Number of Equivalent Gates |
15000
|
15000
|
Number of Inputs |
244
|
244
|
Number of Logic Cells |
484
|
484
|
Number of Outputs |
244
|
244
|
Number of Terminals |
304
|
304
|
Organization |
484 CLBS, 15000 GATES
|
484 CLBS, 15000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HFQFP
|
HFQFP
|
Package Equivalence Code |
HQFP304,1.7SQ,20
|
HQFP304,1.7SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.5 mm
|
4.5 mm
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
40 mm
|
40 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare XC5215-5HQ304C with alternatives
Compare XC5215-6HQ304I with alternatives