XC5VFX70T-1FF1136I
vs
XC5VFX70T-1FF665C
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA-1136
|
BGA-665
|
Pin Count |
1136
|
665
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A991.D
|
3A991.D
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Combinatorial Delay of a CLB-Max |
0.9 ns
|
0.9 ns
|
JESD-30 Code |
S-PBGA-B1136
|
S-PBGA-B665
|
JESD-609 Code |
e0
|
e0
|
Length |
35 mm
|
27 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
5600
|
5600
|
Number of Inputs |
640
|
360
|
Number of Logic Cells |
71680
|
71680
|
Number of Outputs |
640
|
360
|
Number of Terminals |
1136
|
665
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
5600 CLBS
|
5600 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1136,34X34,40
|
BGA665,26X26,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
225
|
225
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.25 mm
|
2.9 mm
|
Supply Voltage-Max |
1.05 V
|
1.05 V
|
Supply Voltage-Min |
0.95 V
|
0.95 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
35 mm
|
27 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
72 Weeks
|
|
|
|
Compare XC5VFX70T-1FF1136I with alternatives
Compare XC5VFX70T-1FF665C with alternatives