XC5VLX50T-1FF1136C vs XC5VLX50T-1FF1136I feature comparison

XC5VLX50T-1FF1136C AMD Xilinx

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XC5VLX50T-1FF1136I AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description BGA-1136 BGA-1136
Pin Count 1136 1136
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 72 Weeks 72 Weeks
Combinatorial Delay of a CLB-Max 0.9 ns 0.9 ns
JESD-30 Code S-PBGA-B1136 S-PBGA-B1136
JESD-609 Code e0 e0
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 3600 3600
Number of Inputs 480 480
Number of Logic Cells 46080 46080
Number of Outputs 480 480
Number of Terminals 1136 1136
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 3600 CLBS 3600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1136,34X34,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.25 mm
Supply Voltage-Max 10.5 V 10.5 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 1 1

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Compare XC5VLX50T-1FF1136I with alternatives