XC5VSX50T-2FF1136I vs XC5VSX50T-2FFG1136C feature comparison

XC5VSX50T-2FF1136I AMD

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XC5VSX50T-2FFG1136C AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Package Description BGA-1136 BGA-1136
Reach Compliance Code not_compliant compliant
Factory Lead Time 12 Weeks 72 Weeks
Combinatorial Delay of a CLB-Max 0.77 ns 0.77 ns
JESD-30 Code S-PBGA-B1136 S-PBGA-B1136
JESD-609 Code e0 e1
Length 35 mm 35 mm
Moisture Sensitivity Level 4 4
Number of CLBs 4080 4080
Number of Inputs 480 480
Number of Logic Cells 52224 52224
Number of Outputs 480 480
Number of Terminals 1136 1136
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4080 CLBS 4080 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1136,34X34,40 BGA1136,34X34,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.25 mm 3.25 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 35 mm 35 mm
Base Number Matches 2 2
Pbfree Code Yes
Part Package Code BGA
Pin Count 1136
ECCN Code 3A991.D
HTS Code 8542.39.00.01

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