XC6SLX150-3FG676I vs XC6SLX150-3FG676C feature comparison

XC6SLX150-3FG676I AMD Xilinx

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XC6SLX150-3FG676C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, FBGA-676 27 X 27 MM, 1 MM PITCH, FBGA-676
Pin Count 676 676
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.21 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e0 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 11519 11519
Number of Inputs 498 498
Number of Logic Cells 147443 147443
Number of Outputs 498 498
Number of Terminals 676 676
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 11519 CLBS 11519 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1

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Compare XC6SLX150-3FG676C with alternatives