XC6SLX25T-2CSG324C vs XA6SLX25T-2CSG324Q feature comparison

XC6SLX25T-2CSG324C AMD Xilinx

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XA6SLX25T-2CSG324Q AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description 15 X 15 MM, 0.80 MM PITCH, LEAD FREE, BGA-324
Pin Count 324
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 62.5 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Length 15 mm
Moisture Sensitivity Level 3 3
Number of CLBs 1879
Number of Inputs 190 190
Number of Logic Cells 24051 24051
Number of Outputs 190 190
Number of Terminals 324 324
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 1879 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA324,18X18,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 15 mm
Base Number Matches 1 1
Screening Level AEC-Q100

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Compare XA6SLX25T-2CSG324Q with alternatives