XC6SLX4-2CSG225I feature comparison

XC6SLX4-2CSG225I AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Package Description 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
Pin Count 225
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Clock Frequency-Max 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B225
JESD-609 Code e1
Length 13 mm
Moisture Sensitivity Level 3
Number of CLBs 300
Number of Inputs 120
Number of Logic Cells 3840
Number of Outputs 120
Number of Terminals 225
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 300 CLBS
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA225,15X15,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm
Base Number Matches 1

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