XC6SLX4-2CSG225I vs XA6SLX4-2CSG225I feature comparison

XC6SLX4-2CSG225I AMD Xilinx

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XA6SLX4-2CSG225I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
Pin Count 225
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 62.5 MHz
Combinatorial Delay of a CLB-Max 0.26 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B225
JESD-609 Code e1 e1
Length 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 300
Number of Inputs 120 132
Number of Logic Cells 3840 3840
Number of Outputs 120 132
Number of Terminals 225 225
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 300 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA FBGA
Package Equivalence Code BGA225,15X15,32 BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm
Supply Voltage-Max 1.26 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm
Base Number Matches 1 1
Screening Level AEC-Q100

Compare XC6SLX4-2CSG225I with alternatives

Compare XA6SLX4-2CSG225I with alternatives