XC6SLX4-2CSG225I vs XC6SLX4-3CSG225C feature comparison

XC6SLX4-2CSG225I AMD Xilinx

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XC6SLX4-3CSG225C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225 13 X 13 MM, 0.80 MM PITCH, LEAD FREE, BGA-225
Pin Count 225 225
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 862 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.21 ns
JESD-30 Code S-PBGA-B225 S-PBGA-B225
JESD-609 Code e1 e1
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of CLBs 300 300
Number of Inputs 120 120
Number of Logic Cells 3840 3840
Number of Outputs 120 120
Number of Terminals 225 225
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 300 CLBS 300 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA225,15X15,32 BGA225,15X15,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.4 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 13 mm 13 mm
Base Number Matches 1 1

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