XC6SLX75T-2FGG676I vs XC6SLX75T-2FG676C feature comparison

XC6SLX75T-2FGG676I AMD Xilinx

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XC6SLX75T-2FG676C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-676 27 X 27 MM, 1 MM PITCH, FBGA-676
Pin Count 676 676
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 667 MHz 667 MHz
Combinatorial Delay of a CLB-Max 0.26 ns 0.26 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e0
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5831 5831
Number of Inputs 320 320
Number of Logic Cells 74637 74637
Number of Outputs 320 320
Number of Terminals 676 676
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 5831 CLBS 5831 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1

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Compare XC6SLX75T-2FG676C with alternatives