XC6SLX9-3FTG256I vs XC6SLX9-N3FTG256C feature comparison

XC6SLX9-3FTG256I AMD Xilinx

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XC6SLX9-N3FTG256C AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256
Pin Count 256
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 862 MHz 806 MHz
Combinatorial Delay of a CLB-Max 0.21 ns 0.26 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 715 715
Number of Inputs 186 186
Number of Logic Cells 9152 9152
Number of Outputs 186 186
Number of Terminals 256 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 715 CLBS 715 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 17 mm
Base Number Matches 1 1

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