XC6VHX565T-1FF1924C vs XC6VHX565T-2FFG1924C feature comparison

XC6VHX565T-1FF1924C AMD Xilinx

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XC6VHX565T-2FFG1924C AMD Xilinx

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-1924 45 X 45 MM, LEAD FREE, FBGA-1924
Pin Count 1924 1924
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A991.D 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1098 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 5.08 ns 4.29 ns
JESD-30 Code S-PBGA-B1924 S-PBGA-B1924
JESD-609 Code e0 e1
Length 45 mm 45 mm
Moisture Sensitivity Level 4 4
Number of Inputs 640 640
Number of Logic Cells 566784 566784
Number of Outputs 640 640
Number of Terminals 1924 1924
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1924,44X44,40 BGA1924,44X44,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.85 mm 3.85 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 45 mm 45 mm
Base Number Matches 1 1

Compare XC6VHX565T-1FF1924C with alternatives

Compare XC6VHX565T-2FFG1924C with alternatives