XC6VLX130T-2FFG784C
vs
XC6VLX130T-L1FF784C
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
29 X 29 MM, LEAD FREE, FBGA-784
|
29 X 29 MM, FBGA-784
|
| Pin Count |
784
|
784
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.D
|
3A991.D
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
52 Weeks
|
|
| Clock Frequency-Max |
1286 MHz
|
1098 MHz
|
| Combinatorial Delay of a CLB-Max |
4.29 ns
|
5.87 ns
|
| JESD-30 Code |
S-PBGA-B784
|
S-PBGA-B784
|
| JESD-609 Code |
e1
|
e0
|
| Length |
29 mm
|
29 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of Inputs |
400
|
400
|
| Number of Logic Cells |
128000
|
128000
|
| Number of Outputs |
400
|
400
|
| Number of Terminals |
784
|
784
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA784,28X28,40
|
BGA784,28X28,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
220
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.1 mm
|
3.1 mm
|
| Supply Voltage-Max |
1.05 V
|
0.93 V
|
| Supply Voltage-Min |
0.95 V
|
0.87 V
|
| Supply Voltage-Nom |
1 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
29 mm
|
29 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC6VLX130T-2FFG784C with alternatives
Compare XC6VLX130T-L1FF784C with alternatives