XC7A100T-1CSG324I vs XC7A100T-2CSG324I feature comparison

XC7A100T-1CSG324I AMD Xilinx

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XC7A100T-2CSG324I AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 324 324
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1098 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.05 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e1
Length 15 mm 15 mm
Moisture Sensitivity Level 3 3
Number of CLBs 7925 7925
Number of Inputs 300 300
Number of Logic Cells 101440 101440
Number of Outputs 300 300
Number of Terminals 324 324
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C -40 °C
Organization 7925 CLBS 7925 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA324,18X18,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.5 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 15 mm 15 mm
Base Number Matches 1 1

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