XC7A200T-1FBG484C vs XC7A200T-1SB484I feature comparison

XC7A200T-1FBG484C AMD Xilinx

Buy Now Datasheet

XC7A200T-1SB484I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 484 484
Reach Compliance Code compliant unknown
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e1 e0
Length 23 mm 19 mm
Moisture Sensitivity Level 4
Number of CLBs 16825 16825
Number of Inputs 285 285
Number of Logic Cells 215360 215360
Number of Outputs 285 285
Number of Terminals 484 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 16825 CLBS 16825 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FBGA
Package Equivalence Code BGA484,22X22,40 BGA484,22X22,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 250 NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.54 mm 2.44 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 23 mm 19 mm
Base Number Matches 1 1
Package Description 19 X 19 MM, 0.80 MM PITCH, FBGA-484

Compare XC7A200T-1FBG484C with alternatives

Compare XC7A200T-1SB484I with alternatives