XC7A35T-1CSG324C vs XC7A35T-1CPG236C feature comparison

XC7A35T-1CSG324C AMD Xilinx

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XC7A35T-1CPG236C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 324 236
Reach Compliance Code compliant compliant
ECCN Code 3A991.D EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B324 S-PBGA-B236
JESD-609 Code e1 e1
Length 15 mm 10 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2600 2600
Number of Inputs 250 250
Number of Logic Cells 33280 33280
Number of Outputs 250 250
Number of Terminals 324 236
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 2600 CLBS 2600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA324,18X18,32 BGA236,19X19,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.5 mm 1.38 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 15 mm 10 mm
Base Number Matches 1 1

Compare XC7A35T-1CSG324C with alternatives

Compare XC7A35T-1CPG236C with alternatives