XC7A35T-1CSG324I feature comparison

XC7A35T-1CSG324I AMD Xilinx

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Part Package Code BGA
Pin Count 324
Reach Compliance Code compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 65 Weeks
Clock Frequency-Max 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns
JESD-30 Code S-PBGA-B324
JESD-609 Code e1
Length 15 mm
Moisture Sensitivity Level 3
Number of CLBs 2600
Number of Inputs 250
Number of Logic Cells 33280
Number of Outputs 250
Number of Terminals 324
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 2600 CLBS
Package Body Material PLASTIC/EPOXY
Package Code LFBGA
Package Equivalence Code BGA324,18X18,32
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.5 mm
Supply Voltage-Max 1.05 V
Supply Voltage-Min 0.95 V
Supply Voltage-Nom 1 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 15 mm
Base Number Matches 1

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