XC7A35T-1FTG256I vs XC7A35T-1FGG484I feature comparison

XC7A35T-1FTG256I AMD Xilinx

Buy Now Datasheet

XC7A35T-1FGG484I AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Part Package Code BGA BGA
Package Description LFBGA, BGA256,16X16,40 FBGA-484
Pin Count 256 484
Reach Compliance Code compliant compliant
Country Of Origin Taiwan Taiwan
ECCN Code EAR99 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
YTEOL 9.6 9.6
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B484
JESD-609 Code e1 e1
Length 17 mm 23 mm
Moisture Sensitivity Level 3 3
Number of CLBs 2600 2600
Number of Inputs 250 250
Number of Logic Cells 33280 33280
Number of Outputs 250 250
Number of Terminals 256 484
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 2600 CLBS 2600 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA BGA
Package Equivalence Code BGA256,16X16,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 260 250
Power Supplies 1 V 1 V
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 2.6 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 23 mm
Base Number Matches 1 1
Technology CMOS

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