XC7A50T-2CPG236I vs XC7A50T-2FTG256C feature comparison

XC7A50T-2CPG236I AMD Xilinx

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XC7A50T-2FTG256C AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description LFBGA, BGA236,19X19,20
Pin Count 236 256
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1286 MHz 1286 MHz
Combinatorial Delay of a CLB-Max 1.05 ns 1.05 ns
JESD-30 Code S-PBGA-B236 S-PBGA-B256
JESD-609 Code e8 e1
Length 10 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 4075 4075
Number of Inputs 250 250
Number of Logic Cells 52160 52160
Number of Outputs 250 250
Number of Terminals 236 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4075 CLBS 4075 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA236,19X19,20 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.38 mm 1.55 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 10 mm 17 mm
Base Number Matches 1 1

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