XC7A75T-L2FGG676E vs XC7A75T-L2FTG256E feature comparison

XC7A75T-L2FGG676E AMD Xilinx

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XC7A75T-L2FTG256E AMD Xilinx

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Pin Count 676 256
Reach Compliance Code compliant compliant
ECCN Code 3A991.D EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks
Additional Feature ALSO OPERATES AT 1V SUPPLY ALSO OPERATES AT 1V NOMINAL SUPPLY
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.51 ns 1.51 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B256
JESD-609 Code e1 e1
Length 27 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 5900 5900
Number of Inputs 300 300
Number of Logic Cells 75520 75520
Number of Outputs 300 300
Number of Terminals 676 256
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min
Organization 5900 CLBS 5900 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA LFBGA
Package Equivalence Code BGA676,26X26,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 250 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 1.55 mm
Supply Voltage-Max 0.93 V 0.93 V
Supply Voltage-Min 0.87 V 0.87 V
Supply Voltage-Nom 0.9 V 0.9 V
Surface Mount YES YES
Technology CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 17 mm
Base Number Matches 1 1
Package Description LFBGA, BGA256,16X16,40
Temperature Grade OTHER

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Compare XC7A75T-L2FTG256E with alternatives