XC7S75-1FGGA676Q vs XC7S75-1FGGA484Q feature comparison

XC7S75-1FGGA676Q AMD Xilinx

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XC7S75-1FGGA484Q AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description BGA, BGA676,26X26,40 FPBGA-484
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 65 Weeks 65 Weeks
Clock Frequency-Max 1098 MHz 1098 MHz
Combinatorial Delay of a CLB-Max 1.27 ns 1.27 ns
JESD-30 Code S-PBGA-B676 S-PBGA-B484
JESD-609 Code e3 e1
Length 27 mm 23 mm
Number of CLBs 6000 6000
Number of Inputs 400 400
Number of Logic Cells 76800 76800
Number of Outputs 400 400
Number of Terminals 676 484
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 6000 CLBS 6000 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA484,22X22,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology HKMG HKMG
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish MATTE TIN TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 27 mm 23 mm
Base Number Matches 1 1

Compare XC7S75-1FGGA676Q with alternatives

Compare XC7S75-1FGGA484Q with alternatives