XC7VX485T-3FFG1927E vs XC7VX485T-3FFG1927C feature comparison

XC7VX485T-3FFG1927E AMD Xilinx

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XC7VX485T-3FFG1927C AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA
Package Description FBGA-1927
Pin Count 1927
Reach Compliance Code not_compliant not_compliant
ECCN Code 3A001.A.7.B
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 1818 MHz
Combinatorial Delay of a CLB-Max 0.58 ns
JESD-30 Code S-PBGA-B1927
JESD-609 Code e1 e1
Length 45 mm
Moisture Sensitivity Level 4 4
Number of CLBs 37950
Number of Inputs 600
Number of Logic Cells 485760
Number of Outputs 600
Number of Terminals 1927
Operating Temperature-Max 100 °C
Operating Temperature-Min
Organization 37950 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA1924,44X44,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.65 mm
Supply Voltage-Max 1.03 V
Supply Voltage-Min 0.97 V
Supply Voltage-Nom 1 V
Surface Mount YES
Technology CMOS
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 45 mm
Base Number Matches 1 1

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