XC7VX690T-1FFG1927I
vs
XC7VX690T-1FFG1927C
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
FBGA-1927
|
FBGA-1927
|
Pin Count |
1927
|
1927
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
3A001.A.7.B
|
3A001.A.7.B
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
1818 MHz
|
1818 MHz
|
Combinatorial Delay of a CLB-Max |
0.74 ns
|
0.74 ns
|
JESD-30 Code |
S-PBGA-B1927
|
S-PBGA-B1927
|
JESD-609 Code |
e1
|
e1
|
Length |
45 mm
|
45 mm
|
Moisture Sensitivity Level |
4
|
4
|
Number of CLBs |
54150
|
54150
|
Number of Inputs |
600
|
600
|
Number of Logic Cells |
693120
|
693120
|
Number of Outputs |
600
|
600
|
Number of Terminals |
1927
|
1927
|
Operating Temperature-Max |
100 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
54150 CLBS
|
54150 CLBS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA1924,44X44,40
|
BGA1924,44X44,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.65 mm
|
3.65 mm
|
Supply Voltage-Max |
1.03 V
|
1.03 V
|
Supply Voltage-Min |
0.97 V
|
0.97 V
|
Supply Voltage-Nom |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
45 mm
|
45 mm
|
Base Number Matches |
1
|
1
|
Temperature Grade |
|
OTHER
|
|
|
|
Compare XC7VX690T-1FFG1927I with alternatives
Compare XC7VX690T-1FFG1927C with alternatives