XC7Z030-2FBG676E
vs
XC7Z030-2FBG484I
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
BGA,
|
FBGA-484
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
3A991.D
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
65 Weeks
|
65 Weeks
|
| JESD-30 Code |
S-PBGA-B676
|
S-PBGA-B484
|
| Length |
27 mm
|
23 mm
|
| Number of Terminals |
676
|
484
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA676,26X26,40
|
BGA484,22X22,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Seated Height-Max |
2.54 mm
|
2.54 mm
|
| Supply Voltage-Max |
1.05 V
|
1.05 V
|
| Supply Voltage-Min |
0.95 V
|
0.95 V
|
| Supply Voltage-Nom |
1 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
23 mm
|
| uPs/uCs/Peripheral ICs Type |
SoC
|
SoC
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XC7Z030-2FBG676E with alternatives
Compare XC7Z030-2FBG484I with alternatives