XC9536XL-10CS48C vs XC9536XV-3CS48I feature comparison

XC9536XL-10CS48C AMD Xilinx

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XC9536XV-3CS48I AMD Xilinx

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description CSP-48 FBGA,
Pin Count 48 48
Reach Compliance Code not_compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks
Additional Feature YES
Clock Frequency-Max 100 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B48 S-PBGA-B48
JESD-609 Code e0 e0
JTAG BST YES
Length 7 mm 7 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 36 36
Number of Inputs 36
Number of Macro Cells 36
Number of Outputs 36
Number of Terminals 48 48
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 36 I/O 0 DEDICATED INPUTS, 36 I/O
Output Function MACROCELL REGISTERED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA48,7X7,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 240
Programmable Logic Type FLASH PLD FLASH PLD
Propagation Delay 10 ns 3.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 1.8 mm
Supply Voltage-Max 3.6 V 2.6 V
Supply Voltage-Min 3 V 2.4 V
Supply Voltage-Nom 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 7 mm 7 mm
Base Number Matches 1 1

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