XCKU040-1FBVA900C
vs
XCKU040-1FFVA1156E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
|
| HTS Code |
8542.39.00.01
|
|
| Factory Lead Time |
52 Weeks
|
|
| JESD-30 Code |
S-PBGA-B900
|
S-PBGA-B1156
|
| JESD-609 Code |
e1
|
e1
|
| Length |
31 mm
|
35 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
1920
|
30300
|
| Number of Inputs |
520
|
520
|
| Number of Logic Cells |
530250
|
530250
|
| Number of Outputs |
520
|
520
|
| Number of Terminals |
900
|
1156
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
|
| Organization |
1920 CLBS
|
30300 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA900,30X30,40
|
BGA1156,34X34,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2.8 mm
|
3.42 mm
|
| Supply Voltage-Max |
0.979 V
|
0.979 V
|
| Supply Voltage-Min |
0.922 V
|
0.922 V
|
| Supply Voltage-Nom |
0.95 V
|
0.95 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
31 mm
|
35 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare XCKU040-1FBVA900C with alternatives