XCKU040-1FFVA1156E vs XCKU040-1FBVA900I feature comparison

XCKU040-1FFVA1156E AMD Xilinx

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XCKU040-1FBVA900I AMD Xilinx

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description FBGA-1156
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-15
JESD-30 Code S-PBGA-B1156 S-PBGA-B900
JESD-609 Code e1 e1
Length 35 mm 31 mm
Moisture Sensitivity Level 4 4
Number of CLBs 30300 1920
Number of Inputs 520 520
Number of Logic Cells 530250 530250
Number of Outputs 520 520
Number of Terminals 1156 900
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C
Organization 30300 CLBS 1920 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA900,30X30,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.42 mm 2.8 mm
Supply Voltage-Max 0.979 V 0.979 V
Supply Voltage-Min 0.922 V 0.922 V
Supply Voltage-Nom 0.95 V 0.95 V
Surface Mount YES YES
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 31 mm
Base Number Matches 1 1
ECCN Code 3A991.D
Factory Lead Time 52 Weeks
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

Compare XCKU040-1FFVA1156E with alternatives

Compare XCKU040-1FBVA900I with alternatives