XCKU040-1FFVA1156E vs XCKU040-1FBVA676I feature comparison

XCKU040-1FFVA1156E AMD

Buy Now Datasheet

XCKU040-1FBVA676I AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ADVANCED MICRO DEVICES INC XILINX INC
Reach Compliance Code compliant compliant
JESD-30 Code S-PBGA-B1156 S-PBGA-B676
JESD-609 Code e1 e1
Length 35 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 30300 1920
Number of Inputs 520 520
Number of Logic Cells 530250 530250
Number of Outputs 520 520
Number of Terminals 1156 676
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C
Organization 30300 CLBS 1920 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA1156,34X34,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.42 mm 2.71 mm
Supply Voltage-Max 0.979 V 0.979 V
Supply Voltage-Min 0.922 V 0.922 V
Supply Voltage-Nom 0.95 V 0.95 V
Surface Mount YES YES
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 35 mm 27 mm
Base Number Matches 2 2
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified
Time@Peak Reflow Temperature-Max (s) 30

Compare XCKU040-1FBVA676I with alternatives