XCKU040-3FBVA900E vs XCKU040-3FBVA676I feature comparison

XCKU040-3FBVA900E AMD Xilinx

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XCKU040-3FBVA676I AMD

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer XILINX INC ADVANCED MICRO DEVICES INC
Package Description FBGA-900 FBGA-676
Reach Compliance Code compliant compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Factory Lead Time 52 Weeks
JESD-30 Code S-PBGA-B900 S-PBGA-B676
JESD-609 Code e1 e1
Length 31 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 1920 30300
Number of Inputs 520 520
Number of Logic Cells 530250 530250
Number of Outputs 520 520
Number of Terminals 900 676
Operating Temperature-Max 100 °C 100 °C
Operating Temperature-Min -40 °C
Organization 1920 CLBS 30300 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA900,30X30,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 2.8 mm 2.71 mm
Supply Voltage-Max 1.03 V 1.03 V
Supply Voltage-Min 0.97 V 0.97 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 31 mm 27 mm
Base Number Matches 2 2

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