XCKU15P-2LFFVE1517E
vs
XCKU15P-L2FFVE1760E
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2018-03-09
|
2016-06-03
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
4
|
4
|
| Peak Reflow Temperature (Cel) |
245
|
245
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A001.A.7.B
|
| Factory Lead Time |
|
52 Weeks
|
| Additional Feature |
|
ALSO OPERATES AT 0.85V NOMINAL SUPPLY
|
| JESD-30 Code |
|
S-PBGA-B1760
|
| Length |
|
42.5 mm
|
| Number of CLBs |
|
65340
|
| Number of Inputs |
|
668
|
| Number of Logic Cells |
|
1143450
|
| Number of Outputs |
|
668
|
| Number of Terminals |
|
1760
|
| Operating Temperature-Max |
|
110 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
65340 CLBs
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
BGA
|
| Package Equivalence Code |
|
BGA1760,42X42,40
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY
|
| Seated Height-Max |
|
3.71 mm
|
| Supply Voltage-Max |
|
0.742 V
|
| Supply Voltage-Min |
|
0.698 V
|
| Supply Voltage-Nom |
|
0.72 V
|
| Surface Mount |
|
YES
|
| Temperature Grade |
|
OTHER
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
42.5 mm
|
|
|
|
Compare XCKU15P-2LFFVE1517E with alternatives
Compare XCKU15P-L2FFVE1760E with alternatives