XCKU3P-3SFVB784E
vs
XCKU3P-3FFVB676E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Package Description |
FBGA, BGA784,28X28,32
|
BGA, BGA676,26X26,40
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.D
|
3A001.A.7.B
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
52 Weeks
|
|
| Date Of Intro |
2016-06-03
|
2016-06-03
|
| JESD-30 Code |
S-PBGA-B784
|
S-PBGA-B676
|
| JESD-609 Code |
e1
|
e1
|
| Length |
23 mm
|
27 mm
|
| Moisture Sensitivity Level |
4
|
4
|
| Number of CLBs |
20340
|
20340
|
| Number of Inputs |
304
|
304
|
| Number of Logic Cells |
355950
|
355950
|
| Number of Outputs |
304
|
304
|
| Number of Terminals |
784
|
676
|
| Operating Temperature-Max |
100 °C
|
100 °C
|
| Operating Temperature-Min |
|
|
| Organization |
20340 CLBS
|
20340 CLBS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FBGA
|
BGA
|
| Package Equivalence Code |
BGA784,28X28,32
|
BGA676,26X26,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
250
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
3.32 mm
|
3.52 mm
|
| Supply Voltage-Max |
0.927 V
|
0.927 V
|
| Supply Voltage-Min |
0.873 V
|
0.873 V
|
| Supply Voltage-Nom |
0.9 V
|
0.9 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
23 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XCKU3P-3SFVB784E with alternatives
Compare XCKU3P-3FFVB676E with alternatives