XCKU5P-1LFFVA676I vs XCKU5P-L1FFVA676I feature comparison

XCKU5P-1LFFVA676I AMD Xilinx

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XCKU5P-L1FFVA676I AMD Xilinx

Buy Now Datasheet
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Package Description , BGA, BGA676,26X26,40
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2018-03-09 2016-06-03
JESD-609 Code e1 e1
Moisture Sensitivity Level 4 4
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 2 2
Rohs Code Yes
ECCN Code 3A991.D
JESD-30 Code S-PBGA-B676
Length 27 mm
Number of CLBs 27120
Number of Inputs 304
Number of Logic Cells 474600
Number of Outputs 304
Number of Terminals 676
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Organization 27120 CLBS
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA676,26X26,40
Package Shape SQUARE
Package Style GRID ARRAY
Seated Height-Max 3.52 mm
Supply Voltage-Max 0.742 V
Supply Voltage-Min 0.698 V
Supply Voltage-Nom 0.72 V
Surface Mount YES
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 27 mm

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Compare XCKU5P-L1FFVA676I with alternatives