XCKU5P-L2FFVA676E vs XCKU5P-L2FFVB676E feature comparison

XCKU5P-L2FFVA676E AMD Xilinx

Buy Now Datasheet

XCKU5P-L2FFVB676E AMD Xilinx

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Reach Compliance Code compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 52 Weeks 52 Weeks
Date Of Intro 2016-06-03 2016-06-03
Additional Feature ALSO OPERATES AT 0.85V NOMINAL SUPPLY ALSO OPERATES AT 0.85V NOMINAL SUPPLY
JESD-30 Code S-PBGA-B676 S-PBGA-B676
JESD-609 Code e1 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 4 4
Number of CLBs 27120 27120
Number of Inputs 304 304
Number of Logic Cells 474600 474600
Number of Outputs 304 304
Number of Terminals 676 676
Operating Temperature-Max 110 °C 110 °C
Operating Temperature-Min
Organization 27120 CLBS 27120 CLBS
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA676,26X26,40 BGA676,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 250
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 3.52 mm 3.52 mm
Supply Voltage-Max 0.742 V 0.742 V
Supply Voltage-Min 0.698 V 0.698 V
Supply Voltage-Nom 0.72 V 0.72 V
Surface Mount YES YES
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 27 mm
Base Number Matches 1 1
Package Description BGA, BGA676,26X26,40

Compare XCKU5P-L2FFVA676E with alternatives

Compare XCKU5P-L2FFVB676E with alternatives