XCL214B333DR
vs
XCL213B333DR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TOREX SEMICONDUCTOR LTD
|
TOREX SEMICONDUCTOR LTD
|
| Package Description |
QCCN,
|
QCCN,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
24 Weeks
|
24 Weeks
|
| Samacsys Manufacturer |
Torex
|
Torex
|
| Additional Feature |
ALSO REQUIRE PFM CONTROL TECHNIQUE
|
ALSO REQUIRE PFM CONTROL TECHNIQUE
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
5.5 V
|
5.5 V
|
| Input Voltage-Min |
2.7 V
|
2.7 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
R-XQCC-N9
|
R-XQCC-N9
|
| Length |
3.2 mm
|
3.2 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
1.5 A
|
1.5 A
|
| Output Voltage-Nom |
3.3 V
|
3.3 V
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
QCCN
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.05 mm
|
1.05 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL SILVER GOLD
|
NICKEL SILVER GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
10
|
10
|
| Width |
2.5 mm
|
2.5 mm
|
| Base Number Matches |
1
|
1
|
|
|
|