XCR3064-10PC44C vs M4-32/32-12JI feature comparison

XCR3064-10PC44C AMD Xilinx

Buy Now Datasheet

M4-32/32-12JI Lattice Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC LATTICE SEMICONDUCTOR CORP
Part Package Code LCC LCC
Package Description PLASTIC, LCC-44 PLASTIC, LCC-44
Pin Count 44 44
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature NO YES
Clock Frequency-Max 80 MHz 50 MHz
In-System Programmable NO YES
JESD-30 Code S-PQCC-J44 S-PQCC-J44
JESD-609 Code e0 e0
JTAG BST NO YES
Length 16.5862 mm 16.5862 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs 2
Number of I/O Lines 32 32
Number of Macro Cells 64 32
Number of Terminals 44 44
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 2 DEDICATED INPUTS, 32 I/O 0 DEDICATED INPUTS, 32 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Equivalence Code LDCC44,.7SQ LDCC44,.7SQ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 4.57 mm
Supply Voltage-Max 3.6 V 5.5 V
Supply Voltage-Min 2.97 V 4.5 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 16.5862 mm 16.5862 mm
Base Number Matches 1 1

Compare XCR3064-10PC44C with alternatives

Compare M4-32/32-12JI with alternatives