XCR3064XL-10VQ100I
vs
PZ3064DS12BP
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
XILINX INC
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
QFP
|
|
| Package Description |
VQFP-100
|
QFP, TQFP100,.63SQ
|
| Pin Count |
100
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
52 Weeks
|
|
| Additional Feature |
YES
|
YES
|
| Clock Frequency-Max |
95 MHz
|
|
| In-System Programmable |
YES
|
YES
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e0
|
| JTAG BST |
YES
|
YES
|
| Length |
14 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Dedicated Inputs |
|
|
| Number of I/O Lines |
68
|
|
| Number of Macro Cells |
64
|
64
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
0 DEDICATED INPUTS, 68 I/O
|
|
| Output Function |
MACROCELL
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFQFP
|
QFP
|
| Package Equivalence Code |
TQFP100,.63SQ
|
TQFP100,.63SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, THIN PROFILE, FINE PITCH
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Programmable Logic Type |
EE PLD
|
EE PLD
|
| Propagation Delay |
10 ns
|
13.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max |
3.6 V
|
|
| Supply Voltage-Min |
2.7 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
14 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XCR3064XL-10VQ100I with alternatives