XCR3384XL-10FGG324C
vs
XCR3384XL-7FG324C
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
XILINX INC
|
Package Description |
FBGA-324
|
FBGA-324
|
Reach Compliance Code |
compliant
|
not_compliant
|
Additional Feature |
YES
|
YES
|
Clock Frequency-Max |
102 MHz
|
135 MHz
|
In-System Programmable |
YES
|
YES
|
JESD-30 Code |
S-PBGA-B324
|
S-PBGA-B324
|
JESD-609 Code |
e1
|
e0
|
JTAG BST |
YES
|
YES
|
Length |
23 mm
|
23 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Dedicated Inputs |
|
|
Number of I/O Lines |
220
|
220
|
Number of Inputs |
220
|
220
|
Number of Macro Cells |
384
|
384
|
Number of Outputs |
220
|
220
|
Number of Terminals |
324
|
324
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
0 DEDICATED INPUTS, 220 I/O
|
0 DEDICATED INPUTS, 220 I/O
|
Output Function |
MACROCELL
|
MACROCELL
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA324,20X20,40
|
BGA324,20X20,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
225
|
Programmable Logic Type |
EE PLD
|
EE PLD
|
Propagation Delay |
10 ns
|
7.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.5 mm
|
2.5 mm
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3 V
|
3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Lead (Sn63Pb37)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
23 mm
|
23 mm
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Part Package Code |
|
BGA
|
Pin Count |
|
324
|
ECCN Code |
|
3A991.D
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare XCR3384XL-7FG324C with alternatives