XCR3512XL-12FGG324I vs XCR3512XL-12FG324C feature comparison

XCR3512XL-12FGG324I AMD Xilinx

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XCR3512XL-12FG324C AMD Xilinx

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-324 FBGA-324
Pin Count 324 324
Reach Compliance Code compliant not_compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature YES YES
Clock Frequency-Max 77 MHz 77 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B324 S-PBGA-B324
JESD-609 Code e1 e0
JTAG BST YES YES
Length 23 mm 23 mm
Moisture Sensitivity Level 3 3
Number of Dedicated Inputs
Number of I/O Lines 260 260
Number of Macro Cells 512 512
Number of Terminals 324 324
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 0 DEDICATED INPUTS, 260 I/O 0 DEDICATED INPUTS, 260 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA324,20X20,40 BGA324,20X20,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 12 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.5 mm 2.5 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.7 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 23 mm 23 mm
Base Number Matches 1 1
Factory Lead Time 12 Weeks

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