XCR3512XL-12PQG208I vs CY37512P208-66UMB feature comparison

XCR3512XL-12PQG208I AMD Xilinx

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CY37512P208-66UMB Cypress Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC CYPRESS SEMICONDUCTOR CORP
Part Package Code QFP QFP
Package Description LEAD FREE, PLASTIC, QFP-208 CERAMIC, QFP-208
Pin Count 208 208
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.39.00.01 8542.39.00.01
Architecture PLA-TYPE PLA-TYPE
Clock Frequency-Max 67.56 MHz 50 MHz
In-System Programmable YES YES
JESD-30 Code S-PQFP-G208 S-CQFP-G208
JESD-609 Code e3 e0
JTAG BST YES YES
Length 28 mm 28 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs 1
Number of I/O Lines 180 160
Number of Inputs 184 165
Number of Macro Cells 512 512
Number of Outputs 180 160
Number of Terminals 208 208
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Organization 0 DEDICATED INPUTS, 180 I/O 1 DEDICATED INPUTS, 160 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code FQFP FQFP
Package Equivalence Code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 245
Programmable Logic Type EE PLD EE PLD
Propagation Delay 12 ns 20 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 3.7 mm
Supply Voltage-Max 3.6 V 5.5 V
Supply Voltage-Min 2.7 V 4.5 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Matte Tin (Sn) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 28 mm 28 mm
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

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