XCR5032-10PC44I vs PZ5032I10BC-S feature comparison

XCR5032-10PC44I AMD Xilinx

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PZ5032I10BC-S AMD Xilinx

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code LCC QFP
Package Description QCCJ, 10 X 10 MM, 1 MM HEIGHT, PLASTIC, TQFP-44
Pin Count 44 44
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 59 MHz 59 MHz
JESD-30 Code S-PQCC-J44 S-PQFP-G44
Length 16.5862 mm 10 mm
Number of Dedicated Inputs 2 2
Number of I/O Lines 32 32
Number of Terminals 44 44
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2 DEDICATED INPUTS, 32 I/O 2 DEDICATED INPUTS, 32 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ TQFP
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER FLATPACK, THIN PROFILE
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 12.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.57 mm 1.2 mm
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form J BEND GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position QUAD QUAD
Width 16.5862 mm 10 mm
Base Number Matches 1 1
Rohs Code No
Additional Feature 32 MACROCELLS
In-System Programmable NO
JTAG BST NO
Moisture Sensitivity Level 3
Number of Macro Cells 32
Package Equivalence Code TQFP44,.47SQ,32
Packing Method TRAY
Peak Reflow Temperature (Cel) 240
Time@Peak Reflow Temperature-Max (s) 30

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