XCS40XL-4PQG208Q
vs
XC4020XLA-08BGG256C
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
XILINX INC
|
| Part Package Code |
QFP
|
BGA
|
| Package Description |
FQFP,
|
BGA,
|
| Pin Count |
208
|
256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
MAXIMUM USABLE GATES = 40000
|
CAN ALSO USE 40000 GATES
|
| Clock Frequency-Max |
217 MHz
|
263 MHz
|
| Combinatorial Delay of a CLB-Max |
1.1 ns
|
1 ns
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
e1
|
| Length |
28 mm
|
27 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
784
|
784
|
| Number of Equivalent Gates |
13000
|
13000
|
| Number of Terminals |
208
|
256
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
784 CLBS, 13000 GATES
|
784 CLBS, 13000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
245
|
250
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.1 mm
|
2.55 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
OTHER
|
| Terminal Finish |
Matte Tin (Sn)
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
28 mm
|
27 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare XCS40XL-4PQG208Q with alternatives
Compare XC4020XLA-08BGG256C with alternatives