XCS40XL-4PQG208Q vs XCS40XL-4BG256Q feature comparison

XCS40XL-4PQG208Q AMD Xilinx

Buy Now Datasheet

XCS40XL-4BG256Q AMD Xilinx

Buy Now Datasheet
Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP BGA
Package Description FQFP, PLASTIC, BGA-256
Pin Count 208 256
Reach Compliance Code compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES = 40000 MAXIMUM USABLE GATES = 40000
Clock Frequency-Max 217 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.1 ns 1.1 ns
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e3 e0
Length 28 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 784 784
Number of Equivalent Gates 13000 13000
Number of Terminals 208 256
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 784 CLBS, 13000 GATES 784 CLBS, 13000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn63Pb37)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 27 mm
Base Number Matches 1 1
Number of Inputs 224
Number of Logic Cells 784
Number of Outputs 224
Package Equivalence Code BGA256,20X20,50

Compare XCS40XL-4PQG208Q with alternatives

Compare XCS40XL-4BG256Q with alternatives