XCS40XL-5BG256C vs XC4020XLA-08PQG208I feature comparison

XCS40XL-5BG256C AMD Xilinx

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XC4020XLA-08PQG208I AMD Xilinx

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA QFP
Package Description PLASTIC, BGA-256 FQFP,
Pin Count 256 208
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 40000 CAN ALSO USE 40000 GATES
Clock Frequency-Max 250 MHz 263 MHz
Combinatorial Delay of a CLB-Max 1 ns 1 ns
JESD-30 Code S-PBGA-B256 S-PQFP-G208
JESD-609 Code e0 e3
Length 27 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 784 784
Number of Equivalent Gates 13000 13000
Number of Inputs 205
Number of Logic Cells 784
Number of Outputs 205
Number of Terminals 256 208
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 784 CLBS, 13000 GATES 784 CLBS, 13000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Equivalence Code BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Peak Reflow Temperature (Cel) 225 245
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.55 mm 4.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish Tin/Lead (Sn63Pb37) MATTE TIN
Terminal Form BALL GULL WING
Terminal Pitch 1.27 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 27 mm 28 mm
Base Number Matches 1 1

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