XCS40XL-5PQG208C vs XCS40XL-3BG256C feature comparison

XCS40XL-5PQG208C AMD Xilinx

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XCS40XL-3BG256C AMD Xilinx

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Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code QFP BGA
Package Description PLASTIC, QFP-208 PLASTIC, BGA-256
Pin Count 208 256
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature MAXIMUM USABLE GATES 40000
Clock Frequency-Max 250 MHz
Combinatorial Delay of a CLB-Max 1 ns
JESD-30 Code S-PQFP-G208 S-PBGA-B256
JESD-609 Code e3 e0
Length 28 mm 27 mm
Moisture Sensitivity Level 3 3
Number of CLBs 784 784
Number of Equivalent Gates 13000 13000
Number of Inputs 169 205
Number of Logic Cells 1862 784
Number of Outputs 169 205
Number of Terminals 208 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 784 CLBS, 13000 GATES 784 CLBS, 13000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Equivalence Code QFP208,1.2SQ,20 BGA256,20X20,50
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Peak Reflow Temperature (Cel) 245 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.1 mm 2.55 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Matte Tin (Sn) Tin/Lead (Sn63Pb37)
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 27 mm
Base Number Matches 1 1
Pbfree Code No

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