XCV100-4FG256C vs XCV100-6FG256C feature comparison

XCV100-4FG256C AMD Xilinx

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XCV100-6FG256C AMD Xilinx

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Pbfree Code No No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer XILINX INC XILINX INC
Part Package Code BGA BGA
Package Description FBGA-256 FBGA-256
Pin Count 256 256
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 250 MHz 333 MHz
Combinatorial Delay of a CLB-Max 0.8 ns 0.6 ns
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 600 600
Number of Equivalent Gates 108904 108904
Number of Inputs 176 176
Number of Logic Cells 2700 2700
Number of Outputs 176 176
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min
Organization 600 CLBS, 108904 GATES 600 CLBS, 108904 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 225 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max 2.625 V 2.625 V
Supply Voltage-Min 2.375 V 2.375 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 30
Width 17 mm 17 mm
Base Number Matches 1 1

Compare XCV100-4FG256C with alternatives

Compare XCV100-6FG256C with alternatives