XCV100-5FG256C
vs
XC2S100-5FG256C
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
XILINX INC
|
ADVANCED MICRO DEVICES INC
|
| Part Package Code |
BGA
|
|
| Package Description |
FBGA-256
|
|
| Pin Count |
256
|
|
| Reach Compliance Code |
not_compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
|
| Clock Frequency-Max |
294 MHz
|
263 MHz
|
| Combinatorial Delay of a CLB-Max |
0.7 ns
|
0.7 ns
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| JESD-609 Code |
e0
|
e0
|
| Length |
17 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
600
|
600
|
| Number of Equivalent Gates |
108904
|
100000
|
| Number of Inputs |
176
|
180
|
| Number of Logic Cells |
2700
|
2700
|
| Number of Outputs |
176
|
176
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
600 CLBS, 108904 GATES
|
600 CLBS, 100000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
2 mm
|
| Supply Voltage-Max |
2.625 V
|
2.625 V
|
| Supply Voltage-Min |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn63Pb37)
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| Samacsys Manufacturer |
|
AMD
|
|
|
|
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